Circuposit™ 3000-1 from Dupont Dow Rhom Hass Company

Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.
 

Key Properties

• Exceptional Interconnect Reliability
• Horizontal or vertical application
• Excellent bath stability and performance
• Reduced bath maintenance
• Reduction in solution volume growth
• Low-build or high-build deposition
   

酸性鍍(dù)銅中間體相關鏈(liàn)接：

垂直連續電鍍（VCP）高TP值酸性鍍銅光澤(zé)劑用電鍍中間體： unisun.cc/news/170.html
 

PCB/FPC用高TP值VCP酸性鍍銅光亮劑中間體産品介紹： unisun.cc/news/30.html
 

2021年度填孔鍍銅——印刷線(xiàn)路闆（PCB，FPC）酸性填孔鍍銅中間體： unisun.cc/news/283.html

 

2021年(nián)國際表面處理展電子展廳：

深圳市同泰化學技術(shù)有限公司參加了2021年7月26-28日在廣州保利世貿博覽館舉辦的第十四屆廣(guǎng)州國際表面處理、電鍍、塗裝展覽會，誠邀您莅臨同泰化學電子展廳參(cān)觀指導！電子(zǐ)展廳鏈接：unisun.cc/news/316.html 。