Copper Gleam™ HV-101 & HV-606 Electrolytic Copper

2022-03-07 09:44

Copper Gleam™ HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.

 

The Copper Gleam™ HV-606 bath has been developed to work with insoluble anodes to deliver high plating performance at high current densities.

 

Key Benefits:

  • Excellent throwing power on through-holes and microvias
  • Exceptional panel plating distribution
  • Exceptional leveling performance on panel surface and inside through holes
  • Round plated shape on via bottom
  • Good thermal reliability
     

Excellent Throwing Power

Exceptional levelling

 

Ideal Microvia
Bottom Shape

 

 

copper-gleam-hv101

 

 

酸性(xìng)鍍銅中間體相關鏈接：

垂直連(lián)續電鍍（VCP）高(gāo)TP值酸性鍍銅光澤(zé)劑用電鍍中間體：unisun.cc/news/170.html
 

PCB/FPC用高(gāo)TP值VCP酸性鍍銅光亮劑(jì)中間體産品介紹：unisun.cc/news/30.html
 

2021年(nián)度填孔鍍銅——印刷線路闆（PCB，FPC）酸性填孔鍍銅中間體：unisun.cc/news/283.html

 

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深(shēn)圳市同泰化學技(jì)術(shù)有限公司(sī)參加了(le)2021年7月26-28日在廣州保利世貿博覽館舉辦的第十四屆廣州國際表(biǎo)面處理、電鍍、塗裝展覽會，誠邀您莅臨同(tóng)泰化學電子展廳參觀指導！電子展廳鏈接：unisun.cc/news/316.html。

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