High-reliability Metallization for Fine-pitch PCB Designs

2022-03-07 09:59

DuPont has long been a market leader in high-performance, high-reliability metallization for demanding PCB applications. As shrinking design guidelines and more challenging operating environments make metallization performance critical to the success of multilayer boards, DuPont is prepared to provide materials that allow you to meet your design goals.

 

We offer a wide variety of options for interlayer metallization, via fill, and final finishes tailored to substrate type and end application. Our materials support your metallization process every step of the way in applications including:

  • IC substrates for advanced packages
  • Challenging multi-layer PCB designs
  • Flexible circuits with demanding configurations
  • Next-generation high-density interconnect (HDI)
  •  

Choose DuPont as your materials solutions partner to:

  • Enable even the most challenging PCB designs
  • Ensure compliance with RoHS and REACH regulations
  • Work with you to develop cost-effective metallization options that meet your needs

 

  • What is PCB Metallization?

    Both rigid and flexible PCBs contain multiple layers of interconnected metal lines. Trends toward device miniaturization and increased functionality are driving down line widths and spacings as well as via diameters. Metallization must be reliable and uniform regardless of surface topography.
     

  • High-density, High-performing PCBs

    Manufacturers of consumer electronics, automobiles, airplanes, 5G networks, and industrial equipment rely on high-density PCBs to keep their customers connected and safe. The metallization inside these PCBs has to be reliable no matter how fine the metal lines or how densely packed the design. Because of cost pressure, yields need to remain high. Choosing metallization products tailored to the type of substrate and the design density optimizes both yield and reliability.
     

Metallization Materials for PCBs

  • IC Substrates
  • Multi-Layered Boards
  • High Density Interconnect
  • Flexible Circuits
     

IC Substrates

Copper plating solutions for substrates in all types of advanced packages.

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A self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications

An Ionic Catalyst and a Tartrate-based Electroless copper that meet demands on interconnect density and reliability

Improving adhesion of the subsequent metal layer for next-generation dielectric materials

Providing uniform copper deposits by ensuring even absorbtion catalyst on dielectric materials

A high throw electroless copper system that enables reliable coverage in microvias while minimizing surface copper deposits, thereby enhancing etching capability.

Designed to lower board manufacturer's ENIG process costs, while maintaining optimum reliability and performance

A high phosphorous Electroless Nickel specifically formulated for use in combination with the Aurolectroless™ SMT 520 Immersion Gold process

Providing complete fill at lower copper thickness, reduced dimples and skip-rate, and improved surface appearance

Providing enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses

Offering excellent blind microvia fill with lower copper surface thickness

Offering excellent laser micro-via fill and pattern plate uniformity of flip-Chip substrates

Providing through hole fill of inner core layers for IC-Substrate PCB with improved reliability, and both electrical and thermal conductivity

 

Formulated for use in combination with Duraposit™ electroless nickel baths and Aurolectroless™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PCBs

 

Formulated to work with both vertical in-line and horizontal equipment used to fabricate HDI and IC Substrates

 

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PCB/FPC用高TP值VCP酸(suān)性鍍銅光亮(liàng)劑中間體産(chǎn)品介(jiè)紹： unisun.cc/news/30.html
 

2021年(nián)度填孔鍍銅——印刷線(xiàn)路闆（PCB，FPC）酸性填孔鍍銅中間體： unisun.cc/news/283.html

 

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