圖片(piàn)名稱

新(xīn)材料科技與(yǔ)化學(xué)技術(shù)創新

電鍍中間(jiān)體/水(shuǐ)性工(gōng)業塗(tú)料(liào)/工業清(qīng)洗化(huà)學品

全(quán)部

全部
産(chǎn)品管理
新(xīn)聞資訊
介紹内(nèi)容(róng)
企業網點
常(cháng)見問題(tí)
企業視(shì)頻
企(qǐ)業(yè)圖冊

搜索

圖(tú)片名稱

+86-755-27225202

圖片名稱

en

新聞資(zī)訊

新材料科技(jì)與化學技術創新

首頁(yè)

圖片(piàn)名稱(chēng)

dsm帝斯曼neorez r-985/r-986聚氨酯分散(sàn)體

産品(pǐn)說明：用于金(jīn)屬面漆，罩(zhào)光清漆，手套塗料，皮革塗(tú)料；用(yòng)作含pvc或(huò)不(bú)含的(de)地闆面(miàn)漆；與丙烯酸乳液(yè)一起(qǐ)用(yòng)于(yú)塑膠塗料(liào)。

發布時間:

2021-01-06

圖(tú)片名稱(chēng)

dow electronic materials introduces new metallization and imaging products for printed circuit boards

unique technology helps create smaller, more sustainable, less expensive consumer electronics.

發布時間:

2022-03-07

圖片名稱

copper gleam™ hv-101 & hv-606 electrolytic copper

copper gleam™ hv-101 and hv-606 electrolytic coppers are the latest offerings for panel plating in vertical-in-line equipment. they deliver high plating efficiency to improve productivity and reduce cost.

發(fā)布(bù)時(shí)間:

2022-03-07

圖片(piàn)名稱

copper gleam™ hs-200 electrolytic copper from dupont dow rhom hass company

the copper gleam™ hs-200 bath is a full bright acid copper plating process specifically formulated for use in conveyorized plating equipment with insoluble anode. formulated for high current density plating, the process is capable of producing uniform, bright deposits of high ductility and tensile strength in accelerated plating times.

發布時(shí)間(jiān):

2022-03-07

圖片(piàn)名稱(chēng)

circuposit™ 3000-1 from dupont dow rhom hass company

circuposit™ 3000-1 electroless copper is a unique, patented process that is widely used by leading pcb fabricators throughout the world. this novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. the 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.

發布時間:

2022-03-07

圖片(piàn)名稱

bondfilm工藝介紹

通常(cháng)來說，bondfilm工藝會将(jiāng)銅微蝕(shí)刻(kè)至1.2 到1.5 µm的厚(hòu)度，同時将(jiāng)銅表面(200 - 300 a)轉化成(chéng)期望(wàng)的有機-金(jīn)屬結構。通(tōng)過這(zhè)個工藝後(hòu)，可見(jiàn)的結果便是形成一個棕色的(de)均勻(yún)鍍(dù)層(céng)。雖然銅的蝕刻會随(suí)着浸置(zhì)時間而不斷(duàn)進行，但是(shì)實際上bondfilm粘附層(céng)的生長(zhǎng)是受(shòu)自(zì)我限制的(de)，在該層的形成和溶(róng)解達到平衡後，就會(huì)達到了一(yī)個最大厚(hòu)度(dù)。

發布時(shí)間:

2021-10-05

< 1...21 22 23 24 >

産品(pǐn)咨(zī)詢(xún) +86-157 9588 8262（吳經理）
阿裏商(shāng)鋪
我要留(liú)言
添加微(wēi)信
返(fǎn)回(huí)頂(dǐng)部

圖片(piàn)名稱(chēng)

微信掃一(yī)掃，關注我(wǒ)們(men)

圖(tú)片名(míng)稱

+86-755-27225202

+86-157 9588 8262（吳經(jīng)理(lǐ)）

圖片(piàn)名稱

© 2019 深圳市同泰化學技術有限公(gōng)司